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High-Precision DES Line | Develop-Etch-Strip Solution

Total wet-process solution for 1-mil L/S. Eliminates the puddle effect. High-yield production for advanced IC substrates and HDI.

The Höllmüller DES Line by TSK Schill is a fully integrated, horizontal wet-chemical solution for Developing, Etching, and Stripping. Specifically engineered for the next generation of ultra-fine line circuit formation, this line provides a seamless and high-yield process for advanced PCB and PCM manufacturing. The system's core advantage is its ability to physically eliminate the "puddle effect" (chemical stagnation) on the substrate surface. Through TSK’s proprietary fluid dynamics and oscillation spray technology, it achieves absolute uniformity and repeatability across large panels and ultra-thin materials. This enables reliable mass production of fine-line circuit patterns down to 1-mil (25μm) definitions. Built with a robust 15mm thick high-quality polypropylene (PP) structure, the DES line is designed for 24/7 industrial durability. It integrates the legacy of Höllmüller’s 40+ years of expertise with modern Beckhoff TwinCAT 3 control systems, providing a future-proof foundation for high-end server-grade PCBs and AI semiconductor packaging.

  • Circuit board processing machine
  • Etching stripping integrated line

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